Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552031 | High precision bonding apparatus comprising heater | Wai Kin Cheung, Yu Fu Cheung | 2023-01-10 |
| 11121113 | Bonding apparatus incorporating variable force distribution | Wai Kin Cheung, Yu Fu Cheung | 2021-09-14 |
| 10199350 | Apparatus for heating a substrate during die bonding | Chi-Wai Cheung, Chin Tung So | 2019-02-05 |
| 7727800 | High precision die bonding apparatus | Wing Fai Lam | 2010-06-01 |
| 6616031 | Apparatus and method for bond force control | Sun Kuen Wong | 2003-09-09 |