Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8651159 | Die bonder providing a large bonding force | Hon Chiu Hui, Yin Fun NG | 2014-02-18 |
| 6949733 | Determination of a movable gantry position including a dual measurement module | Gary Peter Widdowson, Ajit Gaunekar | 2005-09-27 |
| 6616031 | Apparatus and method for bond force control | Ming Yeung Luke Wan | 2003-09-09 |