Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552031 | High precision bonding apparatus comprising heater | Ming Yeung Luke Wan, Wai Kin Cheung | 2023-01-10 |
| 11121113 | Bonding apparatus incorporating variable force distribution | Ming Yeung Luke Wan, Wai Kin Cheung | 2021-09-14 |