Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8564955 | Coupling heat sink to integrated circuit chip with thermal interface material | Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L. Heirich, Michael D. Hillman, Jay S. Nigen +1 more | 2013-10-22 |
| 7961469 | Method and apparatus for distributing a thermal interface material | Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L. Heirich, Michael D. Hillman, Jay S. Nigen +1 more | 2011-06-14 |
| 7440281 | Thermal interface apparatus | Sean Bailey, Richard Lidio Blanco, Jr., David L. Edwards, Supratik Guha, Michael D. Hillman +6 more | 2008-10-21 |