Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8564955 | Coupling heat sink to integrated circuit chip with thermal interface material | Richard Lidio Blanco, Jr., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen +1 more | 2013-10-22 | $104,740,000 |
| 7961469 | Method and apparatus for distributing a thermal interface material | Richard Lidio Blanco, Jr., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen +1 more | 2011-06-14 | $87,004,000 |