Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7485563 | Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method | John S. Guzek | 2009-02-03 |
| 7485017 | Pin grid array package substrate including pins having anchoring elements | Yonggang Li | 2009-02-03 |