Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11336060 | Electrical connector having thick film layers | Mark W. Gailus | 2022-05-17 |
| 10186814 | Electrical connector having a film layer | Mark W. Gailus | 2019-01-22 |
| 8382524 | Electrical connector having thick film layers | Mark W. Gailus | 2013-02-26 |
| 8115110 | Printed circuit board minimizing undesirable signal reflections in a via and methods therefor | Mark W. Gailus | 2012-02-14 |
| 7630210 | Lead(Pb)-free electronic component attachment | Mark W. Gailus | 2009-12-08 |
| 7508681 | Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics | Jason J. Payne, Mark W. Gailus, Huilin Ren | 2009-03-24 |
| 7484971 | Electronic component with high density, low cost attachment | Mark W. Gailus | 2009-02-03 |
| 7240425 | Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board | Mark W. Gailus | 2007-07-10 |
| 7242592 | Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics | Jason J. Payne, Mark W. Gailus, Huilin Ren | 2007-07-10 |