Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869829 | Semiconductor device with through-mold via | Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi +3 more | 2024-01-09 |
| 10811341 | Semiconductor device with through-mold via | Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi +3 more | 2020-10-20 |