Robert C. Marrs — 14 Patents at Amkor Electronics

Robert C. Marrs has been granted 14 US patents while listed as an inventor at Amkor Electronics. The first was granted in 1994 and the most recent in August 2017. Robert C. Marrs ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Robert C. Marrs in Scottsdale, AZ, US.

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Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9732780	Cantilever assembly	Randy Anderson, Edward Aguilar	2017-08-15
6163463	Integrated circuit chip to substrate interconnection	—	2000-12-19	$44,920,000
5795818	Integrated circuit chip to substrate interconnection and method	—	1998-08-18	$7,338,000
5722161	Method of making a packaged semiconductor die including heat sink with locking feature	—	1998-03-03
5701034	Packaged semiconductor die including heat sink with locking feature	—	1997-12-23
5583378	Ball grid array integrated circuit package with thermal conductor	Ronald J. Molnar	1996-12-10
5485037	Semiconductor device having a thermal dissipator and electromagnetic shielding	—	1996-01-16
5483100	Integrated circuit package with via interconnections formed in a substrate	Tadashi Hirakawa	1996-01-09
5482898	Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding	—	1996-01-09
5478007	Method for interconnection of integrated circuit chip and substrate	—	1995-12-26
5455462	Plastic molded package with heat sink for integrated circuit devices	—	1995-10-03
5378869	Method for forming an integrated circuit package with via interconnection	Tadashi Hirakawa	1995-01-03
5355283	Ball grid array with via interconnection	Tadashi Hirakawa	1994-10-11
5328870	Method for forming plastic molded package with heat sink for integrated circuit devices	—	1994-07-12

Robert C. Marrs — 14 Patents

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