Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9732780 | Cantilever assembly | Randy Anderson, Edward Aguilar | 2017-08-15 |
| 6163463 | Integrated circuit chip to substrate interconnection | — | 2000-12-19 |
| 5795818 | Integrated circuit chip to substrate interconnection and method | — | 1998-08-18 |
| 5722161 | Method of making a packaged semiconductor die including heat sink with locking feature | — | 1998-03-03 |
| 5701034 | Packaged semiconductor die including heat sink with locking feature | — | 1997-12-23 |
| 5583378 | Ball grid array integrated circuit package with thermal conductor | Ronald J. Molnar | 1996-12-10 |
| 5485037 | Semiconductor device having a thermal dissipator and electromagnetic shielding | — | 1996-01-16 |
| 5483100 | Integrated circuit package with via interconnections formed in a substrate | Tadashi Hirakawa | 1996-01-09 |
| 5482898 | Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding | — | 1996-01-09 |
| 5478007 | Method for interconnection of integrated circuit chip and substrate | — | 1995-12-26 |
| 5455462 | Plastic molded package with heat sink for integrated circuit devices | — | 1995-10-03 |
| 5378869 | Method for forming an integrated circuit package with via interconnection | Tadashi Hirakawa | 1995-01-03 |
| 5355283 | Ball grid array with via interconnection | Tadashi Hirakawa | 1994-10-11 |
| 5328870 | Method for forming plastic molded package with heat sink for integrated circuit devices | — | 1994-07-12 |