Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit chip to substrate interconnection and method

Integrated circuit chip to substrate interconnection and method

US Patent 5795818 · Granted Aug 18, 1998

Estimated economic value: $7,338,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cantilever assembly2017
Integrated circuit chip to substrate interconnection2000
Method of making a packaged semiconductor die including heat sink with locking f1998
Packaged semiconductor die including heat sink with locking feature1997
Ball grid array integrated circuit package with thermal conductor1996
Semiconductor device having a thermal dissipator and electromagnetic shielding1996
Method for forming a semiconductor device having a thermal dissipator and electr1996
Integrated circuit package with via interconnections formed in a substrate1996
Method for interconnection of integrated circuit chip and substrate1995
Plastic molded package with heat sink for integrated circuit devices1995
Method for forming an integrated circuit package with via interconnection1995
Ball grid array with via interconnection1994