Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721651 | Communication between integrated circuit (IC) dies in wafer-level fan-out package | Chi Fung Poon, Parag Upadhyaya | 2023-08-08 |
| 11003203 | Circuits for and methods of calibrating a circuit in an integrated circuit device | Chi Fung Poon, Parag Upadhyaya | 2021-05-11 |