Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9516765 | Method for producing printed wiring board | Shigeo Nakamura, Yukinori Morikawa | 2016-12-06 |
| 8992713 | Process for producing multilayer printed wiring board | Shigeo Nakamura, Seiichiro Ohashi, Eiichi Hayashi | 2015-03-31 |
| 8584352 | Process for producing multilayer printed wiring board | Hirohisa Narahashi, Shigeo Nakamura | 2013-11-19 |
| 8382996 | Metal-clad laminate | Hirohisa Narahashi, Shigeo Nakamura | 2013-02-26 |
| 8357443 | Laminate including water soluble release layer for producing circuit board and method of producing circuit board | Hirohisa Narahashi, Shigeo Nakamura | 2013-01-22 |
| 8337655 | Process for producing multilayer printed wiring board | Shigeo Nakamura, Seiichiro Ohashi, Eiichi Hayashi | 2012-12-25 |
| 7208062 | Method of producing multilayer printed wiring board | Shigeo Nakamura | 2007-04-24 |
| 7037586 | Film for circuit board | Shigeo Nakamura | 2006-05-02 |
| 6881293 | Process for producing a multi-layer printer wiring board | Shigeo Nakamura | 2005-04-19 |
| 6818702 | Thermosetting resin composition and flexible circuit overcoating material comprising the same | Hiroshi Orikabe, Hiroshi Sakamoto | 2004-11-16 |
| 6805958 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same | Shigeo Nakamura | 2004-10-19 |
| 6739040 | Method of manufacturing multilayered printed wiring board using adhesive film | Shigeo Nakamura | 2004-05-25 |
| 6403221 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same | Shigeo Nakamura | 2002-06-11 |
| 6380343 | Curable resin composition for overcoat of flexible circuit | Hiroshi Orikabe | 2002-04-30 |
| 6376053 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | Shigeo Nakamura | 2002-04-23 |
| 6376609 | Photosensitive resin and photosensitive resin composition containing the same | Shigeo Nakamura | 2002-04-23 |
| 6335417 | Modified polyimide resin and thermosetting resin composition containing the same | Hiroshi Orikabe | 2002-01-01 |
| 6221972 | Photosensitive resin and photosensitive resin composition containing the same | Shigeo Nakamura | 2001-04-24 |
| 6162889 | Curable resin composition for overcoat of flexible circuit | Hiroshi Orikabe | 2000-12-19 |
| 6133377 | Compostion of epoxy resin, phenol-triazine-aldehyde condensate and rubber | Shigeo Nakamura, Yuki Miyazawa | 2000-10-17 |
| 6124023 | Prepreg for laminate and process for producing printed wiring-board using the same | Kiyonori Furuta | 2000-09-26 |
| 5723262 | Resin composition | Shigeo Nakamura, Masahiko Oshimura, Kenichi Mori, Hiroyasu Koto | 1998-03-03 |
| 5439977 | Acid anhydride-containing one package of epoxy resin composition | Hiroyuki Sakata, Kiyomiki Hirai, Koji Takeuchi | 1995-08-08 |
| 5430112 | Epoxy resin and polythiol composition | Hiroyuki Sakata, Kenichi Mori, Kiyomiki Hirai, Koji Takeuchi, Toshihiko Hatajima | 1995-07-04 |
| 5403511 | Ferroelectric liquid crystal composition and ferroelectric liquid crystal display device | Hiroyuki Onishi, Kazuhiro Johten, Tsuyoshi Uemura, Takao Sakurai, Naoko Mikami | 1995-04-04 |