Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7282257 | Resin composition and adhesive film for multi-layered printing wiring board | Kenji Kawai | 2007-10-16 |
| 6818702 | Thermosetting resin composition and flexible circuit overcoating material comprising the same | Hiroshi Sakamoto, Tadahiko Yokota | 2004-11-16 |
| 6433123 | Curable resin composition for overcoat of flexible circuit | — | 2002-08-13 |
| 6380343 | Curable resin composition for overcoat of flexible circuit | Tadahiko Yokota | 2002-04-30 |
| 6335417 | Modified polyimide resin and thermosetting resin composition containing the same | Tadahiko Yokota | 2002-01-01 |
| 6232426 | Epoxy resin composition | Kiyomiki Hirai | 2001-05-15 |
| 6162889 | Curable resin composition for overcoat of flexible circuit | Tadahiko Yokota | 2000-12-19 |