Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482437 | Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board | Masanori Ohkoshi, Eiichi Hayashi | 2022-10-25 |
| 11121020 | Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board | Masanori Ohkoshi, Eiichi Hayashi | 2021-09-14 |
| 8584352 | Process for producing multilayer printed wiring board | Shigeo Nakamura, Tadahiko Yokota | 2013-11-19 |
| 8382996 | Metal-clad laminate | Shigeo Nakamura, Tadahiko Yokota | 2013-02-26 |
| 8357443 | Laminate including water soluble release layer for producing circuit board and method of producing circuit board | Shigeo Nakamura, Tadahiko Yokota | 2013-01-22 |