Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12298328 | Controlling alignment during a thermal cycle | Scott E. Lindsey, Junjye Yeh, Jovan Jovanovic | 2025-05-13 |
| 11977098 | System for testing an integrated circuit of a device and its method of use | Scott E. Lindsey, Junjye Yeh, Jovan Jovanovic | 2024-05-07 |
| 11592465 | Pressure relief valve | Scott E. Lindsey, Junjye Yeh, Jovan Jovanovic | 2023-02-28 |
| 11112429 | Pressure relief valve | Scott E. Lindsey, Junjye Yeh, Jovan Jovanovic | 2021-09-07 |
| 10401385 | Limiting translation for consistent substrate-to-substrate contact | Scott E. Lindsey, Junjye Yeh, Jovan Jovanovic | 2019-09-03 |
| 9880197 | Controlling alignment during a thermal cycle | Scott E. Lindsey, Junyje Yeh, Jovan Jovanovic | 2018-01-30 |
| 9625521 | Controlling alignment during a thermal cycle | Scott E. Lindsey, Junjye Yeh, Jovan Jovanovic | 2017-04-18 |
| 8947116 | System for testing an integrated circuit of a device and its method of use | Scott E. Lindsey, Junyje Yeh, Jovan Jovanovic | 2015-02-03 |
| 8030957 | System for testing an integrated circuit of a device and its method of use | Scott E. Lindsey, Junyje Yeh, Jovan Jovanovic | 2011-10-04 |
| 7303929 | Reloading of die carriers without removal of die carriers from sockets on test boards | Martin A. Hemmerling | 2007-12-04 |
| 7126363 | Die carrier | Martin A. Hemmerling | 2006-10-24 |
| 6859057 | Die carrier | Martin A. Hemmerling | 2005-02-22 |