Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6681982 | Pillar connections for semiconductor chips and method of manufacture | — | 2004-01-27 |
| 6592019 | Pillar connections for semiconductor chips and method of manufacture | — | 2003-07-15 |
| 6578754 | Pillar connections for semiconductor chips and method of manufacture | — | 2003-06-17 |
| 5587336 | Bump formation on yielded semiconductor dies | Tsing-Chow Wang, Serena M. Luo, Marlita F. Macaraeg, Thomas J. Massingill | 1996-12-24 |
| 5387495 | Sequential multilayer process for using fluorinated hydrocarbons as a dielectric | James Cheng Lee, Arshad Ahmad, Chune Lee, Myrna E. Castro | 1995-02-07 |
| 5342495 | Structure for holding integrated circuit dies to be electroplated | Victor Okumoto | 1994-08-30 |
| 5072075 | Double-sided hybrid high density circuit board and method of making same | James Cheng Lee, Arshad Ahmad, Myrna E. Castro | 1991-12-10 |
| 4692839 | Multiple chip interconnection system and package | James Cheng Lee, Richard L. Beck | 1987-09-08 |