JC

James E. Currie

AC Advanced Technology & Materials Co.: 3 patents #122 of 410Top 30%
IBM: 2 patents #32,839 of 70,183Top 50%
Overall (All Time): #1,047,087 of 4,157,543Top 30%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6322600 Planarization compositions and methods for removing interlayer dielectric films Richard J. Brewer, Thomas J. Grebinski, Michael Jones, William H. Mullee, Ann Nguyen 2001-11-27
6267909 Planarization composition for removing metal films Michael Jones, Thomas J. Grebinski 2001-07-31
5993685 Planarization composition for removing metal films Michael Jones, Thomas J. Grebinski 1999-11-30
5267418 Confined water fixture for holding wafers undergoing chemical-mechanical polishing Ronald N. Schulz, Adam D. Ticknor 1993-12-07
5262346 Nitride polish stop for forming SOI wafers Ahmet Bindal 1993-11-16