Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8883533 | Method for manufacturing light emitting diode package | HSIN-CHIANG LIN, PIN-CHUAN CHEN | 2014-11-11 |
| 8853733 | Light emitting diode package and method for manufacturing the same | CHE-HSANG HUANG, PIN-CHUAN CHEN, Wen-Liang Tseng, Yu-Liang Huang | 2014-10-07 |
| 8846422 | Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture | PIN-CHUAN CHEN, HSIN-CHIANG LIN | 2014-09-30 |
| 8828755 | Light-emitting element package and fabrication method thereof | MIN-TSUN HSIEH, Wen-Liang Tseng, Chih-Yung Lin, CHING-LIEN YEH, Chi-Wei Liao | 2014-09-09 |
| 8822277 | Method for manufacturing light emitting diode package | HOU-TE LIN | 2014-09-02 |
| 8809083 | Method of manufacturing light emitting diode | Wen-Liang Tseng | 2014-08-19 |
| 8791493 | Light emitting diode package and method for manufacturing the same | CHE-HSANG HUANG, PIN-CHUAN CHEN, Wen-Liang Tseng, Yu-Liang Huang | 2014-07-29 |
| 8772062 | Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive paste | Wen-Liang Tseng | 2014-07-08 |
| 8658445 | Method for manufacturing phosphor film and method for making LED package having the phosphor film | Wen-Liang Tseng, PIN-CHUAN CHEN | 2014-02-25 |
| 8541799 | Light-emitting element package and fabrication method thereof | MIN-TSUN HSIEH, Wen-Liang Tseng, Chih-Yung Lin, CHING-LIEN YEH, Chi-Wei Liao | 2013-09-24 |
| 8470621 | Method for fabricating a flip-chip semiconductor optoelectronic device | Chester Kuo, Wen-Liang Tseng, Shih-Cheng Huang, PO-MIN TU, YING CHAO YEH +3 more | 2013-06-25 |
| 8384276 | LED lamp structure | MIN-TSUN HSIEH, Wen-Liang Tseng, Chih-Yung Lin, CHING-LIEN YEH | 2013-02-26 |
| 8344406 | Light emitting diode package and manufacturing method thereof | MIN-TSUN HSIEH, Wen-Liang Tseng, Chih-Yung Lin, CHING-LIEN YEH, Chi-Wei Liao +1 more | 2013-01-01 |
| 8270444 | Side emitting semiconductor package | MIN-TSUN HSIEH, Wen-Liang Tseng, Chih-Yung Lin | 2012-09-18 |
| D654444 | LED module | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Wen-Liang Tseng | 2012-02-21 |
| D644189 | LED light bar | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Chi-Wei Liao, Wen-Liang Tseng | 2011-08-30 |
| D642998 | LED module | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Wen-Liang Tseng | 2011-08-09 |
| 7994628 | Package structure of photoelectronic device and fabricating method thereof | Wen-Liang Tseng, JIAN-SHIHN TSANG | 2011-08-09 |
| D642994 | LED light bar | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Chi-Wei Liao, Wen-Liang Tseng | 2011-08-09 |
| D642995 | LED light bar | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Chi-Wei Liao, Wen-Liang Tseng | 2011-08-09 |
| 7989237 | Package structure for solid-state lighting devices and method of fabricating the same | Wen-Liang Tseng | 2011-08-02 |
| D642545 | LED light bar | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Chi-Wei Liao, Wen-Liang Tseng | 2011-08-02 |
| D640212 | LED light bar | Chih-Yung Lin, MIN-TSUN HSIEH, CHING-LIEN YEH, Chi-Wei Liao, Wen-Liang Tseng | 2011-06-21 |
| 7719099 | Package structure for solid-state lighting devices and method of fabricating the same | Wen-Liang Tseng | 2010-05-18 |
| 7508007 | Package structure of light-emitting diode | Wen-Liang Tseng | 2009-03-24 |