Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10890802 | Optical lens, backlight module and display device using same | CHAO-HSIUNG CHANG, LUNG-HSIN CHEN, Wen-Liang Tseng, PIN-CHUAN CHEN, HSIN-CHIANG LIN | 2021-01-12 |
| 10510931 | Side-view light emitting diode package structure | Yi-Sen Lin, Chin-Fu Cheng, Wen-Liang Tseng, PIN-CHUAN CHEN | 2019-12-17 |
| 9842968 | LED package | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, Wen-Liang Tseng | 2017-12-12 |
| 9786642 | Light emitting diode package substrate and light emitting diode package element | Wen-Liang Tseng, LUNG-HSIN CHEN, PIN-CHUAN CHEN, HSIN-CHIANG LIN, CHAO-HSIUNG CHANG | 2017-10-10 |
| 9666568 | Photoelectric device and method of manufacturing the same | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2017-05-30 |
| 9660144 | LED package and LED die | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, Wen-Liang Tseng | 2017-05-23 |
| 9640742 | LED package with reflecting cup | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2017-05-02 |
| 9543486 | LED package with reflecting cup | PIN-CHUAN CHEN, LUNG-HSIN CHEN, Wen-Liang Tseng | 2017-01-10 |
| 9543482 | LED package | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2017-01-10 |
| 9543283 | Light emitting diode package and method for manufacturing same | FU-HSIANG YEH, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2017-01-10 |
| 9437585 | Photoelectric device and method of manufacturing the same | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2016-09-06 |
| 9431591 | LED package with reflecting cup | PIN-CHUAN CHEN, LUNG-HSIN CHEN, Wen-Liang Tseng | 2016-08-30 |
| D763206 | Light emitting diode package | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2016-08-09 |
| D763207 | Light emitting diode package | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2016-08-09 |
| 9406842 | Flip chip light emitting diode packaging structure | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2016-08-02 |
| 9324702 | Photoelectric device | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2016-04-26 |
| 9147809 | Flip chip light emitting diode packaging structure | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-09-29 |
| 9065028 | Flip-chip light emitting diode package with moisture barrier layer | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-06-23 |
| 9048408 | Light emitting diode package | PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-06-02 |
| 9048394 | Light emitting diode package with oxidation-resistant metal coating layer | CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-06-02 |
| 9040325 | Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers | CHAO-HSIUNG CHANG | 2015-05-26 |
| 9040321 | Method for manufacturing light emitting diode packages | PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-05-26 |
| 9018668 | Light emitting diode package | PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-04-28 |
| 8985826 | Backlight module having optcial fiber | CHAO-HSIUNG CHANG | 2015-03-24 |
| 8981447 | Light emitting diode package | PIN-CHUAN CHEN, LUNG-HSIN CHEN | 2015-03-17 |