Issued Patents All Time
Showing 51–75 of 316 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8952619 | Low cost LED driver with integral dimming capability | Kevin D'Angelo, David Alan Brown, George A. Hariman | 2015-02-10 |
| 8947407 | Low cost LED driver with integral dimming capability | Kevin D'Angelo, David Alan Brown, George A. Hariman | 2015-02-03 |
| 8933634 | Low cost LED driver with integral dimming capability | Kevin D'Angelo, David Alan Brown, George A. Hariman | 2015-01-13 |
| 8916965 | Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance | — | 2014-12-23 |
| 8847564 | DC/DC converter using synchronous freewheeling MOSFET | — | 2014-09-30 |
| 8841891 | Time-multiplexed-capacitor DC/DC converter with multiple outputs | — | 2014-09-23 |
| 8823342 | Multiple-output dual-polarity DC/DC converters and voltage regulators | — | 2014-09-02 |
| 8810162 | Low cost LED driver with improved serial bus | Kevin D'Angelo, David Alan Brown | 2014-08-19 |
| 8786216 | Low cost LED driver with improved serial bus | Kevin D'Angelo, David Alan Brown | 2014-07-22 |
| 8779696 | Low cost LED driver with improved serial bus | Kevin D'Angelo, David Alan Brown | 2014-07-15 |
| 8778740 | Process for fabricating multi-die semiconductor package with one or more embedded die pads | Keng Hung Lin | 2014-07-15 |
| 8749222 | Method of sensing magnitude of current through semiconductor power device | — | 2014-06-10 |
| 8728904 | Method of forming isolation structure in semiconductor substrate | Donald R. Disney, Wai Tien Chan | 2014-05-20 |
| 8704503 | Single ended primary inductor converter with over-current and/or over-voltage protection and method for controlling the same | Kevin D'Angelo, Charles Coles | 2014-04-22 |
| 8664715 | Isolated transistor | Donald R. Disney | 2014-03-04 |
| 8659116 | Isolated transistor | Donald R. Disney | 2014-02-25 |
| 8659086 | ESD protection for bipolar-CMOS-DMOS integrated circuit devices | Donald R. Disney, Jun-Wei Chen, HyungSik Ryu, Wai Tien Chan | 2014-02-25 |
| 8593220 | Power MOSFETs with improved efficiency for multi-channel class D audio amplifiers and packaging therefor | — | 2013-11-26 |
| 8539275 | Single wire serial interface | Kevin D'Angelo, David Alan Brown, John So, Jan Nilsson | 2013-09-17 |
| 8513787 | Multi-die semiconductor package with one or more embedded die pads | Keng Hung Lin | 2013-08-20 |
| 8513087 | Processes for forming isolation structures for integrated circuit devices | Donald R. Disney | 2013-08-20 |
| 8502362 | Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance | — | 2013-08-06 |
| 8427235 | Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof | — | 2013-04-23 |
| 8350546 | High voltage SEPIC converter | Kevin D'Angelo, Charles Coles | 2013-01-08 |
| 8310218 | Time-multiplexed-capacitor DC/DC converter with multiple outputs | — | 2012-11-13 |