Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12329983 | Distributed photobiomodulation therapy system with intelligent LED pad | Richard K. Williams, Laura E. Williams | 2025-06-17 |
| 12035433 | Distributed photobiomodulation therapy system and method | Richard K. Williams, Laura E. Williams | 2024-07-09 |
| 11469205 | Universal surface-mount semiconductor package | Richard K. Williams | 2022-10-11 |
| 11388799 | Distributed photobiomodulation therapy system and method | Richard K. Williams, Laura E. Williams | 2022-07-12 |
| 11184981 | Method of supplying electrical power from rigid printed circuit board to another rigid printed circuit board in rigid-flex printed circuit board array | Richard K. Williams | 2021-11-23 |
| 11109458 | Phototherapy system with dynamic drive for light-emitting diodes | Richard K. Williams, Daniel Schell, Joseph P. Leahy | 2021-08-31 |
| 10615146 | Universal surface-mount semiconductor package | Richard K. Williams | 2020-04-07 |
| 10328276 | Sinusoidal drive system and method for phototherapy | Richard K. Williams, Daniel Schell, Joseph P. Leahy | 2019-06-25 |
| 10312111 | Method of fabricating low-profile footed power package | Richard K. Williams | 2019-06-04 |
| 10064276 | 3D bendable printed circuit board with redundant interconnections | Richard K. Williams | 2018-08-28 |
| 10032649 | Method of fabricating low-profile footed power package | Richard K. Williams | 2018-07-24 |
| 10032744 | Universal surface-mount semiconductor package | Richard K. Williams | 2018-07-24 |
| 9895550 | Flexible LED light pad for phototherapy | Richard K. Williams, Yu-Min Lin, Daniel Schell, Joseph P. Leahy | 2018-02-20 |
| 9620439 | Low-profile footed power package | Richard K. Williams | 2017-04-11 |
| 9576932 | Universal surface-mount semiconductor package | Richard K. Williams | 2017-02-21 |
| 9305859 | Integrated circuit die with low thermal resistance | Richard K. Williams | 2016-04-05 |
| 8778740 | Process for fabricating multi-die semiconductor package with one or more embedded die pads | Richard K. Williams | 2014-07-15 |
| 8513787 | Multi-die semiconductor package with one or more embedded die pads | Richard K. Williams | 2013-08-20 |