| 12418988 |
Inductor-integrating embedded support frame and substrate, and manufacturing method thereof |
Wenshi Wang, Lei Feng, Benxia HUANG |
2025-09-16 |
| 12412843 |
Support frame structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Jindong FENG, Jiangjiang ZHAO, Wenshi Wang |
2025-09-09 |
| 12400967 |
Embedded packaging structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Yue BAO, Wenshi Wang |
2025-08-26 |
| 12402414 |
Capacitor and inductor embedded structure and manufacturing method therefor, and substrate |
Lei Feng, Weiyuan YANG, Benxia HUANG, Yejie HONG |
2025-08-26 |
| 12302508 |
Temporary carrier and method for manufacturing coreless substrate thereby |
Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng, Bingsen Xie +1 more |
2025-05-13 |
| 12300511 |
Fabrication method for package structure |
Yuanming Chen, Lei Feng, Benxia HUANG, Yongzhi Zeng, Wei He +1 more |
2025-05-13 |
| 12300576 |
Cyclic cooling embedded packaging substrate and manufacturing method thereof |
Yejie HONG, Benxia HUANG, Lei Feng |
2025-05-13 |
| 12278227 |
Hybrid embedded packaging structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Yejie HONG |
2025-04-15 |
| 12279377 |
Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same |
Xiaowei Xu, Gao HUANG, Benxia HUANG |
2025-04-15 |
| 12256265 |
Data transmission method and apparatus, and storage medium |
Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang |
2025-03-18 |
| 12230581 |
Multi-device graded embedding package substrate and manufacturing method thereof |
Lei Feng, Benxia HUANG, Yejie HONG |
2025-02-18 |