Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402414 | Capacitor and inductor embedded structure and manufacturing method therefor, and substrate | Xianming Chen, Lei Feng, Weiyuan YANG, Benxia HUANG | 2025-08-26 |
| 12300576 | Cyclic cooling embedded packaging substrate and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng | 2025-05-13 |
| 12278227 | Hybrid embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2025-04-15 |
| 12230581 | Multi-device graded embedding package substrate and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2025-02-18 |