Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418988 | Inductor-integrating embedded support frame and substrate, and manufacturing method thereof | Xianming Chen, Wenshi Wang, Lei Feng | 2025-09-16 |
| 12412843 | Support frame structure and manufacturing method thereof | Xianming Chen, Lei Feng, Jindong FENG, Jiangjiang ZHAO, Wenshi Wang | 2025-09-09 |
| 12400967 | Embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Yue BAO, Wenshi Wang | 2025-08-26 |
| 12402414 | Capacitor and inductor embedded structure and manufacturing method therefor, and substrate | Xianming Chen, Lei Feng, Weiyuan YANG, Yejie HONG | 2025-08-26 |
| 12302508 | Temporary carrier and method for manufacturing coreless substrate thereby | Xianming Chen, Jian-Hao Peng, Jida Zhang, Lei Feng, Bingsen Xie +1 more | 2025-05-13 |
| 12300511 | Fabrication method for package structure | Xianming Chen, Yuanming Chen, Lei Feng, Yongzhi Zeng, Wei He +1 more | 2025-05-13 |
| 12300576 | Cyclic cooling embedded packaging substrate and manufacturing method thereof | Xianming Chen, Yejie HONG, Lei Feng | 2025-05-13 |
| 12279377 | Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same | Xianming Chen, Xiaowei Xu, Gao HUANG | 2025-04-15 |
| 12278227 | Hybrid embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Yejie HONG | 2025-04-15 |
| 12230581 | Multi-device graded embedding package substrate and manufacturing method thereof | Xianming Chen, Lei Feng, Yejie HONG | 2025-02-18 |