Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376226 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Benito Joseph Rodriguez, Dillip K. Dash, Po-Chun Yang, Juan-Yi Wu | 2025-07-29 |
| 12341109 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2025-06-24 |
| 12272712 | Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region | Tsang-Yu Liu, Chaung-Lin LAI | 2025-04-08 |
| 12248353 | Method of performing power saving control on display device and related display device | Hung-Yu Huang, Chia-Hui Wang, Shiang-Wei Wang, Sheng-Wen Huang, Tsung-Yi Tsai | 2025-03-11 |
| 12237354 | Chip package and method for forming the same | Tsang-Yu Liu, Chaung-Lin LAI | 2025-02-25 |