Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376226 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Benito Joseph Rodriguez, Shu-Ming Chang, Dillip K. Dash, Juan-Yi Wu | 2025-07-29 |