Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272712 | Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region | Chaung-Lin LAI, Shu-Ming Chang | 2025-04-08 |
| 12237354 | Chip package and method for forming the same | Shu-Ming Chang, Chaung-Lin LAI | 2025-02-25 |