MM

Michael Flores Milo

TI Texas Instruments: 1 patents #311 of 1,036Top 35%
📍 Baguio, PH: #2 of 8 inventorsTop 25%
Overall (2025): #277,926 of 469,880Top 60%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12341126 Bump to package substrate solder joint Dolores Babaran Milo, Allen Dee 2025-06-24