Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417965 | Interconnect for IC package | Ruby Ann Merto Camenforte, Floro Lopez Camenforte, III | 2025-09-16 |
| 12341126 | Bump to package substrate solder joint | Michael Flores Milo, Allen Dee | 2025-06-24 |