Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341126 | Bump to package substrate solder joint | Dolores Babaran Milo, Michael Flores Milo | 2025-06-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341126 | Bump to package substrate solder joint | Dolores Babaran Milo, Michael Flores Milo | 2025-06-24 |