Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424449 | CMP system and method of use | Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, Kei-Wei Chen | 2025-09-23 |
| 12229487 | Hotspot avoidance method of manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, Chih-Hung Chen +1 more | 2025-02-18 |
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2025-02-11 |