Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359090 | Composition and method for polishing and integrated circuit | Ji Cui, Chih-Chieh Chang, Kao-Feng Liao, Peng-Chung Jangjian, Chun-Wei Hsu +4 more | 2025-07-15 |
| 12347735 | In-situ defect count detection in post chemical mechanical polishing | Chun-Hung Liao, Jeng-Chi Lin, Liang-Guang Chen, Huang-Lin Chao | 2025-07-01 |
| 12297375 | Slurry composition and method for polishing and integrated circuit | Ji Cui, Liang-Guang Chen, Kei-Wei Chen, Chun-Wei Hsu, Li-Chieh Wu +6 more | 2025-05-13 |
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho +4 more | 2025-02-11 |