Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12427618 | Chemical-mechanical planarization pad and methods of use | Te-Chien Hou, Chih-Hung Chen, Shich-Chang Suen, Wen P. Liao, Kei-Wei Chen | 2025-09-30 |
| 12359090 | Composition and method for polishing and integrated circuit | Ji Cui, Chi-Jen Liu, Chih-Chieh Chang, Kao-Feng Liao, Peng-Chung Jangjian +4 more | 2025-07-15 |
| 12347735 | In-situ defect count detection in post chemical mechanical polishing | Chun-Hung Liao, Jeng-Chi Lin, Chi-Jen Liu, Huang-Lin Chao | 2025-07-01 |
| 12325102 | Chemical mechanical polishing apparatus and method | Shich-Chang Suen, Kei-Wei Chen | 2025-06-10 |
| 12297375 | Slurry composition and method for polishing and integrated circuit | Ji Cui, Chi-Jen Liu, Kei-Wei Chen, Chun-Wei Hsu, Li-Chieh Wu +6 more | 2025-05-13 |
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2025-02-11 |