Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354910 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen | 2025-07-08 |
| 12347728 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen | 2025-07-01 |