Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354910 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-08 |
| 12347728 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-01 |
| 12322649 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Shu-Cheng Chin, Chih-Chien Chi, Hung-Wen Su +1 more | 2025-06-03 |