Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400862 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Chun-Sheng Chen, Nai-Hao Yang, Kuan-Chia Chen, Yu-Cheng Hsiao +1 more | 2025-08-26 |
| 12354910 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-08 |
| 12347728 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-01 |