Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414484 | RRAM structure | Hai-Dang Trinh, Hsing-Lien Lin, Fa-Shen Jiang | 2025-09-09 |
| 12408354 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chia-Shiung Tsai, Chung-Yi Yu, Rei-Lin Chu | 2025-09-02 |
| 12261197 | Diffusion barrier layer in top electrode to increase break down voltage | Hsing-Lien Lin, Hai-Dang Trinh, Fa-Shen Jiang | 2025-03-25 |
| 12249586 | Film structure for bond pad | Julie Yang, Tzu-Chung Tsai, Yao-Wen Chang | 2025-03-11 |
| 12239035 | Resistive memory cell having a low forming voltage | Hai-Dang Trinh, Hsing-Lien Lin, Tzu-Chung Tsai, Fa-Shen Jiang, Bi-Shen Lee | 2025-02-25 |
| 12199029 | MIM capacitor with a symmetrical capacitor insulator structure | Hsing-Lien Lin, Cheng-Te Lee, Rei-Lin Chu, Yeur-Luen Tu, Chung-Yi Yu | 2025-01-14 |