Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368129 | Temperature controllable bonder equipment for substrate bonding | Han-De Chen, Yun Chen Teng, Jyh-Cherng Sheu, Huicheng Chang, Yee-Chia Yeo | 2025-07-22 |
| 12347696 | Laser de-bonding carriers and composite carriers thereof | Huicheng Chang, Jyh-Cherng Sheu, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2025-07-01 |
| 12327811 | Ion implantation with annealing for substrate cutting | Huicheng Chang, Jyh-Cherng Sheu, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2025-06-10 |
| 12266574 | Flowable chemical vapor deposition (FCVD) using multi-step anneal treatment and devices thereof | Yun Chen Teng, Li-Chi Yu, Huicheng Chang, Yee-Chia Yeo | 2025-04-01 |
| 12255171 | Wafer bonding system and method of using the same | Han-De Chen, Yun Chen Teng, Jyh-Cherng Sheu, Huicheng Chang, Yee-Chia Yeo | 2025-03-18 |
| 12249592 | Dynamic bonding gap control and tool for wafer bonding | Han-De Chen, Cheng-I Chu, Yun Chen Teng, Jyh-Cherng Sheu, Huicheng Chang +1 more | 2025-03-11 |
| 12237211 | Bonding system with sealing gasket and method for using the same | Chieh Chang, Yun Chen Teng, Han-De Chen, Jyh-Cherng Sheu, Huicheng Chang +1 more | 2025-02-25 |
| 12230532 | Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof | Yun Chen Teng, Han-De Chen, Jyh-Cherng Sheu, Huicheng Chang, Yee-Chia Yeo | 2025-02-18 |
| 12211820 | Wafer bonding apparatus and method | Cheng-I Chu, Han-De Chen, Jyh-Cherng Sheu, Huicheng Chang, Yee-Chia Yeo | 2025-01-28 |