Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249592 | Dynamic bonding gap control and tool for wafer bonding | Han-De Chen, Yun Chen Teng, Chen-Fong Tsai, Jyh-Cherng Sheu, Huicheng Chang +1 more | 2025-03-11 |
| 12211820 | Wafer bonding apparatus and method | Han-De Chen, Chen-Fong Tsai, Jyh-Cherng Sheu, Huicheng Chang, Yee-Chia Yeo | 2025-01-28 |