Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308287 | Integrated circuit structure with backside dielectric layer having air gap | Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng | 2025-05-20 |
| 12310057 | Semiconductor devices including backside vias and methods of forming the same | Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng | 2025-05-20 |
| 12255102 | Methods of forming of inner spacer structure using semiconductor material with variable germanium concentration | Jiun-Ming Kuo, Ji-Yin Tsai, Yuan-Ching Peng | 2025-03-18 |