HM

Hiroyuki Mori

MM Mitsubishi Materials: 4 patents #2 of 48Top 5%
TL Toyota Central R&D Labs: 1 patents #3 of 25Top 15%
OM Omron: 1 patents #119 of 361Top 35%
IBM: 1 patents #1,197 of 3,866Top 35%
SO Sony: 1 patents #767 of 2,279Top 35%
TO Toyota: 1 patents #1,126 of 3,229Top 35%
📍 Kyoto, JP: #7 of 67 inventorsTop 15%
Overall (2025): #9,753 of 469,880Top 3%
8
Patents 2025

Issued Patents 2025

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
12385851 Management system, management device, management method, and program Keita SAJI, Mayuko Tanaka 2025-08-12
12385110 Pure copper plate Yuki Ito, Hiroyuki Matsukawa, Norihisa Iida, Motohiro Hitaka 2025-08-12
12359284 Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate Hirotaka Matsunaga, Kosei Fukuoka, Kazunari Maki, Kenji Morikawa, Shinichi Funaki 2025-07-15
12364044 Solid-state imaging apparatus and electronic apparatus Tetsuya Uchida, Ryoji Suzuki, Hisahiro ANSAI, Yoichi Ueda, Shinichi Yoshida +6 more 2025-07-15
12342455 Layer-to-layer registration measurement mark 2025-06-24
12331386 Pure copper plate Hirotaka Matsunaga, Yuki Ito, Norihisa Iida, Motohiro Hitaka 2025-06-17
12241496 Member for fastening and method of manufacturing same Hideaki Matsuoka, Gaku Kitahara, Tatsuyuki Amago, Jun Yaokawa, Kyosuke IZUNO +3 more 2025-03-04
12203158 Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate Hirotaka Matsunaga, Kosei Fukuoka, Kazunari Maki, Kenji Morikawa, Shinichi Funaki 2025-01-21