Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359284 | Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate | Hirotaka Matsunaga, Kazunari Maki, Kenji Morikawa, Shinichi Funaki, Hiroyuki Mori | 2025-07-15 |
| 12281376 | Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate | Hirotaka Matsunaga, Kazunari Maki | 2025-04-22 |
| 12203158 | Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate | Hirotaka Matsunaga, Kazunari Maki, Kenji Morikawa, Shinichi Funaki, Hiroyuki Mori | 2025-01-21 |