Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359284 | Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate | Hirotaka Matsunaga, Kosei Fukuoka, Kenji Morikawa, Shinichi Funaki, Hiroyuki Mori | 2025-07-15 |
| 12286698 | Pure copper material, insulating substrate, and electronic device | Takumi Odaira, Yuki Ito, Kenichiro Kawasaki | 2025-04-29 |
| 12281376 | Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate | Hirotaka Matsunaga, Kosei Fukuoka | 2025-04-22 |
| 12264390 | Pure copper material, insulating substrate, and electronic device | Yuki Ito, Takumi Odaira, Kenichiro Kawasaki | 2025-04-01 |
| 12264407 | Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same | Kazuaki Sakai, Naoki Miyashima, Shinichi Funaki | 2025-04-01 |
| 12203158 | Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate | Hirotaka Matsunaga, Kosei Fukuoka, Kenji Morikawa, Shinichi Funaki, Hiroyuki Mori | 2025-01-21 |