Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431403 | Semiconductor package including thermal interface material (TIM) layers on semiconductor chips | Kiwook Jung, Jaechoon Kim, Sungeun JO | 2025-09-30 |
| 12243803 | Thermal interface material, method of manufacturing the same, and semiconductor packages including the same | Seokkan Ki, Youngsuk Nam, Jaechoon Kim, Bangweon Lee, Seungtae Hwang | 2025-03-04 |
| 12237268 | Integrated circuit semiconductor device | Jaechoon Kim, Kyungsuk Oh, Keungbeum Kim, Eonsoo Jang | 2025-02-25 |