Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431403 | Semiconductor package including thermal interface material (TIM) layers on semiconductor chips | Jaechoon Kim, Seunggeol Ryu, Sungeun JO | 2025-09-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431403 | Semiconductor package including thermal interface material (TIM) layers on semiconductor chips | Jaechoon Kim, Seunggeol Ryu, Sungeun JO | 2025-09-30 |