Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243803 | Thermal interface material, method of manufacturing the same, and semiconductor packages including the same | Seunggeol Ryu, Youngsuk Nam, Jaechoon Kim, Bangweon Lee, Seungtae Hwang | 2025-03-04 |