Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heejung CHOI, Heeseok Lee, Bongwee YU | 2025-02-11 |
| 12213256 | Semiconductor package for improving power integrity characteristics | Junghwa KIM, Heeseok Lee, Moonseob Jeong, Jisoo Hwang | 2025-01-28 |