Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381169 | Semiconductor package | Soojeoung Park, Hei Seung Kim | 2025-08-05 |
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heejung CHOI, Junso Pak, Bongwee YU | 2025-02-11 |
| 12213256 | Semiconductor package for improving power integrity characteristics | Junghwa KIM, Junso Pak, Moonseob Jeong, Jisoo Hwang | 2025-01-28 |