Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heejung CHOI, Heeseok Lee, Junso Pak | 2025-02-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heejung CHOI, Heeseok Lee, Junso Pak | 2025-02-11 |