Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431416 | Chip package with integrated current control | Chun-Yuan Cheng, Chao-Chin Lee | 2025-09-30 |
| 12354978 | Coupled loop and void structure integrated in a redistribution layer of a chip package | Po-Wei Chiu, Tzu-No Chen, Hong Shi, Young-Soo Lee | 2025-07-08 |
| 12355000 | Package comprising a substrate and a high-density interconnect integrated device | Yangyang SUN, Zhimin Song | 2025-07-08 |